芯片贴装工艺工程师/Die Attach Process Engineer

Texas InstrumentsChengdu, Sichuan, China, No.8-8 Kexin Road, High-tech Zone(West), Chengdu, CN

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Posted on: 17 Jul 2026

Job Description

岗位职责： 1. 负责半导体封装Die Attach（固晶/芯片贴装）工序量产工艺管控、参数调试与制程优化； 2. 主导固晶工序良率提升、制程异常分析、不良根因定位及闭环改善； 3. 编制、修订固晶工序工艺规范、作业指导书（SOP）、 FMEA、制程管控文件； 4. 负责新产品NPI导入、物料适配验证、固晶胶/芯片基材工艺适配测试； 5. 对接设备、品质、生产部门，解决量产端固晶偏移、虚焊、掉晶、气泡等工艺类不良问题。

Job Overview

Salary:

Not disclosed

JOB TYPE:

Not specified

Experience:

Not mentioned

Job Location:

Chengdu, Sichuan, China, No.8-8 Kexin Road, High-tech Zone(West), Chengdu, CN

Job Level:

Not specified

Education:

Graduation