Director of Package Design

Lead and mentor a team of talented package design engineers, supporting their career growth and professional development. Drive optimal silicon packaging solution supporting Azure datacenter product roadmap. Drive package technology for chiplet architecture with advanced 2.5D/3D packaging. Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout Define, design and develop test vehicles to validate Silicon, Package, System performance. Drive supplier assessments and manage suppliers through definition, development, qualification and production. Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options. Define EDA tools requirements for advanced 3DIC packaging designs Design and develop package and assembly drawings to support the manufacturing. Design and develop package and assembly drawings to support the manufacturing. Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers. Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR Equivalent Experience. This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable. Doctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 10+ years technical engineering experience OR Master's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 15+ years technical engineering experience OR Bachelor's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 18+ years technical engineering experience OR equivalent experience. 15+ years of hands-on experience in Semiconductor Package design, development, manufacturing, supplier management or quality management Experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D) Foundation in advanced packaging technologies, manufacturing and supplier management Proficient in IC package or PCB board layout CAD tools Cadence Allegro Working knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs. Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis Experience with OSAT, Supplier & Foundry technologies. Experience in physical failure analysis Experience in subcontract supplier management. Experience in cross-functional team environment