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塑封工艺工程师/Molding Process Engineer

Texas InstrumentsChengdu, Sichuan, China, No.8-8 Kexin Road, High-tech Zone(West), Chengdu, CN
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Posted on: 17 Jul 2026

Job Description

岗位职责： 1. 负责半导体Molding（环氧塑封）工序全流程工艺管控、参数优化、量产制程维护； 2. 解决塑封工序溢料、空洞、分层、翘曲、封装开裂等工艺量产不良； 3. 负责塑封料物料验证、固化工艺优化、产品外观及电性一致性管控； 4. 编制塑封工序工艺标准、生产管控文件，推进制程能力CPK提升； 5. 参与封装产品结构评审、新产品塑封方案落地与试产跟进。。

Job Overview

Salary:
Not disclosed
JOB TYPE:
Not specified
Experience:
Not mentioned
Job Location:
Chengdu, Sichuan, China, No.8-8 Kexin Road, High-tech Zone(West), Chengdu, CN
Job Level:
Not specified
Education:
Graduation