As a Senior Program Manager at Intel in Tokyo, Japan, you are driving the development and delivery of cutting-edge substrate packaging and wafer assembly solutions, shaping the future of advanced packaging for next-generation AI devices. This pivotal role entails collaborating with cross-functional teams to integrate substrate technology, ensuring seamless execution of projects from conception to delivery. By joining the Advanced Packaging Technology Development Substrate and Wafer Assembly team, you are contributing to Intel's success in the semiconductor industry, pushing the boundaries of innovation and enabling the creation of powerful, efficient, and sustainable technologies. With the opportunity to work at the forefront of packaging technologies, you are not only advancing your career but also making a significant impact on the industry, with tremendous growth and advancement potential.

As a Senior Program Manager, your key responsibilities include:

• Developing and implementing project plans, resource allocation, and risk management strategies to ensure timely and within-budget delivery of advanced packaging solutions


• Collaborating with stakeholders, including engineering teams, suppliers, and customers, to drive project execution and resolve complex technical issues


• Leading and mentoring high-performing teams, fostering a culture of innovation, quality, and corporate social responsibility


• Conducting quality assurance and testing to ensure compliance with Intel's high standards and industry regulations


• Applying artificial intelligence and machine learning techniques to optimize packaging processes and improve overall efficiency


• Building and maintaining relationships with external partners and suppliers to stay up-to-date with industry trends and emerging technologies


• Analyzing data and metrics to inform project decisions, identify areas for improvement, and drive process enhancements. You are working closely with the Substrate Technology Integration Group, within the Advanced Packaging Technology Development team, to drive project execution, resolve technical issues, and ensure seamless communication across teams. To excel in this role, you possess strong technical skills in assembly, packaging, and quality assurance, as well as excellent leadership, communication, and project management skills.

By joining Intel as a Senior Program Manager in Tokyo, Japan, you are becoming part of a dynamic