As a Silicon Packaging Design Engineer at Intel, you are driving the end-to-end development of innovative substrate designs, playing a crucial role in the company's success. Your expertise directly impacts the performance, cost, and manufacturability of Intel's products, helping maintain leadership in the semiconductor industry. Working collaboratively with cross-functional teams, you optimize silicon-package-board interfaces, contributing to groundbreaking advancements. This role entails collaborating with global teams, analyzing complex data, and developing creative solutions to drive innovation. By joining Intel, you become part of a dynamic team shaping the future of technology, with opportunities for growth and advancement in a company that values innovation and excellence. The impact and scope of this position are significant, as your work will influence the development of cutting-edge products that transform industries and improve lives.

Your day-to-day responsibilities as a Silicon Packaging Design Engineer include:

• Designing and developing innovative substrate designs that meet performance, cost, and manufacturability requirements


• Collaborating with cross-functional teams to optimize silicon-package-board interfaces and drive product development


• Analyzing complex data to identify trends, optimize designs, and improve yields


• Developing and implementing design rules, guidelines, and methodologies to ensure compliance with industry standards


• Working closely with manufacturing teams to ensure seamless production and minimize defects


• Staying up-to-date with industry trends and emerging technologies to drive innovation and stay ahead of the competition


• Participating in design reviews, providing feedback, and ensuring that designs meet quality and reliability standards. You will be working in a dynamic environment, leveraging your technical expertise in semiconductors, packaging, and analytics to drive results. Your strong communication and collaboration skills will enable you to work effectively with global teams, driving collective success.

By joining Intel in Malaysia, Penang, Malaysia, as a Silicon Packaging Design Engineer, you become part of a vibrant community that values innovation, collaboration, and growth. Intel offers a unique opportunity to work on cutting-edge technologies, driving industry trends and shaping the future of