焊线工艺&设备工程师/Wire Bond Process and Equipment Engineer

Texas InstrumentsChengdu, Sichuan, China, No.8-8 Kexin Road, High-tech Zone(West), Chengdu, CN

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Posted on: 17 Jul 2026

Job Description

岗位职责： 1. 兼顾Wire Bond（引线键合）工序工艺管控+设备运维全模块工作； 2. 负责金线/铝线/铜线焊线制程参数优化、量产良率管控、打火不良、断线、拉力不达标等工艺异常整改； 3. 负责焊线机台日常保养、故障维修、设备校准、机台稼动率提升； 4. 完成焊线工序新产品导入、工艺验证、工艺文件编制； 5. 统筹焊线工序工艺和设备类问题闭环，推进产线标准化落地。

Job Overview

Salary:

Not disclosed

JOB TYPE:

Not specified

Experience:

Not mentioned

Job Location:

Chengdu, Sichuan, China, No.8-8 Kexin Road, High-tech Zone(West), Chengdu, CN

Job Level:

Not specified

Education:

Graduation